 |
![[What's New Icon]](../images/bnews.gif){kind=small} |
![[Products Icon]](../images/bprdsrv.gif){kind=small} |
![[Feedback Icon]](../images/bfeed.gif){kind=small} |
|
Polymetallurgical Corporation |
|
| FINE
WIRE PRODUCTS
All wire products are available in 100 ft to 2000 ft single and multiple strand configurations on industry standard spools.
|
PMC supplies Gold, Aluminum and
Aluminum-Silicon bonding wire products to the semiconductor and
micro-electronics industries. Used in chip-to-chip or chip-to-substrate
bonding applications, wire is produced to meet the precise specifications
required for elongation, minimum break load and tensile strength.
Aluminum Wire: especially suited for ultrasonic bonding, Aluminum wire is available in either 99.99% purity, or 99.88% purity for increased corrosion control. Sizes range from 0.003 inch to 0.020 inch diameter. For applications demanding finer sizes, Al-1%Si wire is also available. Gold Wire: available in regular strength or high strength versions, gold wire is supplied for thermosonic and ultrasonic bonding applications. Starting with high purity gold, the raw material is refined and cast to a highly controlled chemical composition to meet the exact mechanical properties needed for the customer's application. Popular sizes range from 0.0005 inch to 0.0020 inch diameter. Larger sizes are also available. Palmet® alloys are also available in wire sizes from 0.002 inch to 0.006 inch diameters. Please see our Palmet® page for more details. Please send us a brief description of your requirements via:
|
